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| VME64, VME64x Terminator Technical Data Sheet RoHS Compliant Parts Available Description This Thevenin termination network provides high performance resistor termination for VME64 and VME64x back planes. Designed with a ceramic substrate, this device minimizes parasitic capacitance and inductance, a primary cause of reduced system performance. In addition, the BGA package eases touting design, saving the designer many hours of printed circuit layout. The BGA packaging has been proven to reduce rework and improve reliability Features * * * * * * 8-Bit Termination Network VME64, VME64x Compliant Low Channel Capacitance Laser Trimmed Resistance to 1% Slim BGA Package RoHS Compliant Designs Available * Compatible with both lead and lead free processes Style G 3 R1 2 R2 1 A B C D E F G H Electrical Specifications Resistor Tolerance: TCR Operating Temperature Range Maximum Resistor Power: Maximum Package Power: Process Requirements: Maximum Re-flow Temperature 1.0% 200ppm/C -55C to +125C 0.05 Watts at 70C 1.0 Watts at 70C Per IPC/JEDEC J-STD-020C Typical Applications VME64x Backplane 3.3V RT2211 Card Card Card Card 3.3V RT2211 Standard Termination VME64 +5V Low Voltage Termination VME64x +3.3V 330 220 470 1.8K RT2210 RT2211 Ordering Information Standard Part No. RT1210B7 RT1211B7 R1 330 220 R2 470 1800 Array Size 3x8 3x8 Pitch (mm) 1.00 1.00 RoHS Part No. RT2210B7 RT2211B7 Packaging Information Suffix Tape Width Carrier Pitch Reel Diameter Parts/Reel TR7 24 mm 8 mm 7 inch 1,000 TR13 24mm 8 mm 13 inch 4,000 Part Number Coding 7 inch reel, Add TR7 to part number, example RT2210B7TR7 13 inch reel, Add TR13 to part number, example RT2210B7TR13 (Bulk packaging is not available) Direction of Feed CTS Electronic Components www.ctscorp.com (c) 2006 CTS Corporation. All rights reserved. Information subject to change Page 1 VME64 & VME64x Terminators March 06 Recommended Land Pattern BGA Routing Schemes Outline of Substrate Blind vias to ground reference pla ne layer recomme nded o n every oth er row as shown. Blind vias to VCC reference pla ne layer recomme nded o n every oth er row as shown. Blind vias to ground reference plane layer recommended on every other row as shown. Termination Island Vias to Vcc Solder mask is used to define the ball pads. PCB Pad Diameter 1.00 mm Pitch (B7) = 0.51mm/.020 inch Solder Mask Dia = Pad Diameter +.15mm (.006 inch) For .006" Thick Solder Paste Stencil, Aperture Opening Should be Equal to the PCB Pad Diameter. Refer to www.ctscorp.com/components/clearone.asp for additional PCB design information Option A Option B Mechanical Diagram L H W RT_2__B7 CTS YRWK A1 Identifier P (Pitch) P (Pitch) K D 1.0mm Pitch RT1210B7 RT1211B7 RT2210B7 RT2211B7 mm inch L 8.000.15 .315.006 W 3.000.15 .157.006 H 1.190.15 .047.006 P 1.000.25 .039.010 D 0.640.05 .025.002 K 0.500.25 .020.010 Complete ClearONE Product, Processing, and Application Information can be found at the following link: http://www.ctscorp.com/components/clearone.asp CTS Electronic Components www.ctscorp.com (c) 2006 CTS Corporation. All rights reserved. Information subject to change Page 2 VME64 & VME64x Terminators March 06 |
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